Substrate and Microchip Edge Rounding
Edge Shaping and Beveling - Edge Grinding and Polishing
A unique edging process could solve your microchip, window, and substrate corner rounding problems.
- Edge rounding and chamfering
- Edge shaping and beveling
- Edge lapping and polishing
- Edge deburring and blending
- Laser slag removal - click here for more information
- Sharp corner rounding and deburring
- Prepare edges for circuit wraparound applications
- Enhanced - via edge rounding and contouring
The degree of rounding is controllable to a few microns. This process is adaptable to most materials including Ceramics, Fused quartz-Silica, Glass, Silicon, Aluminum Nitride, hard metals, and various other hard and semi-hard materials.
For more information, go to:
- www.laserslag.com Laser hole and edge chamfering and blending
- www.edgepolishing.com Edge and angle polishing
- www.siliconwafers.net/edge-rounding Substrate edge rounding and blending
- www.semi.org SEMI Semiconductor wafer edge rounding specifications
- www.customdicing.com/wafer-dicing Wafer dicing, sawing, singulating and backgrinding
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