Dicing and Sawing of All Types of Materials
Dicing and backgrinding of:
- Sapphire substrates and wafers
- Ceramic substrates, Piezo Ceramics and hybrid circuits
- Capacitors - chips
- Quartz, Fused Silica, and Glass, substrates wafers and plates
- Semiconductor and compound semiconductor materials
- Thin metals and small diameter rods
- Ferrites
- Bonded wafers and MEMS wafers and substrates
- And all types of special materials
Cutting and Shaping:
- Thick plates and rods
- Grooves and slots
- Pyramids
- Round, bevel, and chamfer
- Cut steps
For a complete summary of company's dicing capabilities click here.
Please click here for a dicing quotation per your specifications.
Informative dicing Web sites:
- www.customdicing.com/bonded-wafers.htm Dicing MEMS wafers
- www.customdicing.com/custom-dicing.htm Custom dicing
- www.customdicing.com/rfq.htm Precision optical dicing
- www.customdicing.com/thin-dice.htm Thin dice by thinning after dicing
- www.customdicing.com/wafer-dicing.htm Wafer dicing, sawing, singulating and backgrinding
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