Alumina dicing and Aluminum Nitride Dicing Services
Dicing services are available for all types of substrates and wafers made from a wide range of ceramics including 99.6% Alumina, Aluminum Nitride (AlN), 96% Alumina, Macor, Steatite, Silicon Carbide, Direct Bond Copper (DBC) substrates, and many others. Ultra-precise, smooth, chip free edges are achievable in a wide variety of shapes and sizes. Using high RPM diamond blades with blade widths as low as .001” (25um), repeatability and precision is achievable to as low as .00004” (1um).
Ceramic substrates may be as fired, lapped or polished, and may be metalized with or without patterns. Die as small as .127mm square have been achieved, as well as all other sizes up to 6” square. Larger than 6” square or diameter, such as 8” wafers may be diced if quartered first. Valley can handle small R&D prototype projects, up to large production volumes. Thicknesses of these ceramic wafers can range from 25um (.001”) up to 6.35mm (.250”) thick. Diamond cut diameters, hexes and other custom shapes are also achievable. Slots, trenches and steps can be diced to extremely tight tolerances.
Valley Design has over 45 years of experience in dicing hard and brittle ceramic thick film, thin film and high dielectric ceramic substrates for a wide variety of applications. Valley Design is ready to work with you and provide you with our extensive expertise in ceramics dicing, as well as dicing of many other materials including Fused Silica and Quartz, Glass of all types, Sapphire, Silicon, Metals and more. Also keep us in mind for precision lapping, optical polishing, 4 & 5 Axis CNC machining, hole drilling, grinding and other precision machining services.
We have a large inventory of many of these materials, and have 1000’s of finished wafers and substrates from stock available for immediate shipment.
For a complete summary of Valley Design’s dicing capabilities, click here.
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