Dicing bonded MEMS wafers and dicing substrates

MEMS Bonded Wafer Dicing

Whether or not your bonded wafers have etched patterns or circuitry, we will provide precise dicing of your chips.

Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass or Quartz , and any other bonded wafers. Depending on the material, the dicing kerf may be as small as 1mil (25 microns) and the die size as small as 5 mils (125 microns) square.

Valley provides precision dicing services for both R & D efforts as well as high volume contract dicing requirements.

For a complete summary of dicing capabilities click here.

Return to Home Page: Dicing hybrid, semiconductor and dicing MEMS wafers





Go to valleydesign.com

Return to Home Page:Dicing hybrid, semiconductor and dicing MEMS wafers

print page




Valley Design East
Phoenix Park Business Center
2 Shaker Road, Bldg. E-001
Shirley, MA 01464
Phone: 978.425.3030
Fax: 978.425.3031
Valley Design
Santa Cruz, CA 95060  
Phone: 831.420.0595  
Fax: 831.420.0592
©2015 Valley Design Corp. All Rights Reserved