MEMS Bonded Wafer Dicing
Whether or not your bonded wafers have etched patterns or circuitry, we will provide precise dicing of your chips.
Valley has the technology to handle Silicon-on-Glass, GaAs-on-Glass or Quartz , and any other bonded wafers. Depending on the material, the dicing kerf may be as small as 1mil (25 microns) and the die size as small as 5 mils (125 microns) square.
Valley provides precision dicing services for both R & D efforts as well as high volume contract dicing requirements.
For a complete summary of dicing capabilities click here.
Additional information on related Web sites:
- www.customdicing.com/custom-dicing Dicing, cutting and singulating different materials
- www.customdicing.com/edge-rounding Diced chip and substrate edge rounding
- www.siliconwafers.net Polished Silicon wafers
- www.siliconwafers.net/thinned Silicon wafers thinned to produce thinner dice
- www.ultra-thin.com/mems MEMS and Bonded SOI Silicon wafers
- www.memsnet.org MEMS information clearing house
- www.customdicing.com/wafer-dicing Wafer dicing, sawing, singulating and backgrinding
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